Executive Summary
The artificial intelligence data center boom is driving unprecedented demand for cooling infrastructure, triggering a global manufacturing expansion of chillers, thermal management systems, and related equipment. However, this rapid buildout carries significant systemic risks that extend far beyond data centers themselves.
This report examines the interconnected dynamics of cooling infrastructure investment, the vulnerability of dependent industries to supply chain disruptions, and the financial risks posed by potential oversupply in a market built on speculative artificial intelligence adoption forecasts.
1. The Cooling Capacity Buildout
1.1 Major Manufacturing Expansions
The scale of manufacturing investment in cooling equipment is extraordinary. XNRGY, a Montreal-based thermal management specialist, exemplifies this trend through aggressive expansion:
- Four significant facility expansions within three years
- Total North American footprint expanded to nearly 1 million square feet across Arizona and Quebec
- Mesa 2 facility: 330,000 square feet dedicated to next-generation air-cooled chillers with proprietary AI controls and Copeland compressor technology
- Capacity target: 3,000 advanced chillers annually once fully operational
- Employment creation: Approximately 500 jobs in Mesa alone
XNRGY's expansion is backed by major institutional investors including BlackRock's Decarbonization Partners, Temasek, Climate Investment (BlackRock-Temasek joint venture), and Activate Capital, signaling confidence in long-term demand.
Beyond XNRGY, competing manufacturers are simultaneously expanding production capacity:
| Manufacturer | Location | Investment | Jobs Created | Focus Area |
|---|---|---|---|---|
| Modine | Grenada, Mississippi | $38 million (through 2028) | 450+ | Data center chillers |
| AAON (BASX) | Longview, Texas | Significant undisclosed | Already staffing | Liquid cooling systems |
| AAON (BASX) | Memphis, Tennessee | Undisclosed (787,000 sq ft) | Planned | Thermal management equipment |
| Henkel | Brandon, South Dakota | $30 million | Not disclosed | Thermal management materials for EV/electronics |
AAON specifically secured $174.5 million in orders from a single customer for custom liquid cooling systems, with equipment deliveries expected primarily in the first half of 2025. The company emphasized having "considerable excess capacity" at its existing facilities while simultaneously investing in new incremental capacity.
1.2 Market Growth Forecasts
Market research firms project substantial growth in cooling-related markets, driving investment decisions:
| Market Segment | 2024/2025 Valuation | 2030/2032/2034 Projection | CAGR |
|---|---|---|---|
| Global Chillers | $12.56 billion (2025) | $16.19 billion (2030) | 5.2% |
| Thermal Management Systems | $81.97 billion (2025) | $141.00 billion (2032) | 8.1% |
| Data Center Immersion Cooling | $1.81 billion (2025) | $8.52 billion (2034) | 18.81% |
| Refrigeration Compressors | $19.2 billion (2024) | $26.7 billion (2030) | 4.7% |
| Cooling Towers | $3.0-9.5 billion (2024/2025) | $3.9-14.9 billion (2029/2035) | 4.6-5.3% |
These projections assume sustained growth in data center construction driven by AI adoption, but they do not incorporate significant demand deceleration scenarios.
2. The Data Center Construction Boom
2.1 Scale of Infrastructure Investment
The data center construction boom is reaching historic proportions, creating the demand signal that justifies cooling equipment investment:
According to McKinsey, data centers will require approximately $6.7 trillion in capital expenditures worldwide by 2030 to keep pace with projected demand. The data center construction market itself expanded from $236.50 billion in 2024 to $257.67 billion in 2025.
Key demand drivers include:
- AI training and inference workloads requiring 5-10x the power and cooling of traditional enterprise data centers
- Rack power densities surging from 5-15 kW to 50-100 kW or higher per rack
- Goldman Sachs forecasts global data center power demand growing 50% by 2027 and 165% by 2030
- DNV estimates AI-driven data center power demand will rise tenfold by 2030
- Electrical infrastructure and cooling systems account for 81% of total data center construction costs
2.2 Thermal Management Requirements
High-density AI workloads have fundamentally altered cooling technology deployment patterns. NVIDIA's latest AI chips consume up to 300% more power than predecessors, forcing hyperscalers to adopt advanced cooling approaches:
- Rear-door heat exchangers (RDHx): Currently standard for new installations, targeting 70% liquid cooling and 30% air cooling deployment ratios
- Direct-to-chip (DTC) cooling: Retrofitting solutions for existing facilities, enabling higher-density workload transitions
- Immersion cooling: Expected to become common as GPU densities exceed 150 kW per rack, though currently deployed in less than 10% of data centers due to technical challenges including liquid quality, reliability, and structural load-bearing requirements (cooling baths can weigh up to four metric tons when filled)
This cooling technology cascade creates multiple revenue opportunities for equipment manufacturers but also extends supply chain dependencies across multiple tiers of suppliers.